Microsilicon Tech

Meeting the challenge of wafer level packaging solutions
MST addresses the challenge of meeting the needs of application-centric products, design and manufacturing flexibility, time-to-market, and cost with our expertise in CPU, audio, video, graphics, wireless and smart power packaging.

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SiP Turn Key Service

MST has advanced SiP (System in Package) assembly technology, testing methodology.  We can provide customized products with smaller form factor,  good electrical performance, lower power consumption and cost effective turn-key service.

Technical proposal and cost estimation

●Design for packaging, include RDL and simulation

●Design for testing, test plan and test program development

●Reliability qualification service

●Prototype manufacturing and validation.

Mass production