Microsilicon Tech

ABOUT Microsilicon Tech
Microsilicon Tech(MST) is an innovative advanced wafer level packaging service provider founded by Chinese Academy of Sciences, and several public funds. MST provides comprehensive Fan-out Wafer Level Packaging (FOWLP) and Fan-out System in a Package (FOSiP) solutions for a wide range of end markets including mobile internet devices, high frequency RF device, Internet of Things (IoT), automotive, industrial, and medical electronics. Our turnkey packaging services can take a design from concept to a completed, tested and packaged semiconductor chips in record time.
The result- the from factor, profile, I/O density and performance of chips can be improved significantly by the advanced Fan-out packaging technology!