Microsilicon Tech
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Fan-Out Wafer Level Packaging (FOWLP) offers numerous performance and cost advantages in terms of smaller form factor and thinner package, higher I/O density, multi-die solutions, and more.

Features

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Performance & Form Factor
♦High signal transition efficiency
♦Reduce power consumption
♦Height could be reduced significantly in PoP without substrate

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Flexibility & Reliability
♦High freedom for RDL design especially for RF trace
♦Lower the operation temperature significantly by shorten thermal dissipation path

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Heterogeneous Integration
♦Multiple dies can be packaged together
♦High I/O density: >500/cm2

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